작성일 : 12-12-28 15:24
 Electroplating bath and power, Cu only.bmp [0] DATE : 2012-12-28 15:24:32 | ||||||||||||||||
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 A list of additional components |
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Detailed specification -4 inch wafer
-piece wafer
-Au layer is desired as a conducting layer
-thermal controller
-water pump
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Electroplating bath and power, Cu only![Electroplating bath and power, Cu only.bmp [0] DATE : 2012-12-28 15:24:32](javascript:file_download('./download.php?bo_table=Fabrication&wr_id=107&no=0&sca=Fabrication&page=3', 'Electroplating bath and power, Cu only.bmp');){kind=link}
