작성일 : 17-03-08 09:25
Basic process
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   Manual for MEMS process.pdf  DATE : 2017-03-08 09:48:02
   https://drive.google.com/file/d/0Bx3mQ0mFUCyVdGU1ODFkX29BQVE/view?usp=… [285]
   https://drive.google.com/file/d/0Bx3mQ0mFUCyVN3JHeUNVVnptMk0/view?usp=… [274]
1. Photolithography : contamination, safety issues, equipment(spin coater, mask aligner, hot plate etc.) 
- Si Wafer preparation (standard cleaning)
- Photoresist coating (positive or negative)
- Softbake (hot plate or oven)
- Exposure (use a mask aligner)
- Postexposure bake(option)
- Development (commercial solution)
- Pattern check with an optical microscope (We often use a SEM to confime a cross section of the PR)
- Hardbake (This is desird when you do wet-etching)
 
2. TMAH etching
- Natural oxide removal using a BHF solution
- Dipping a Si wafer into the TMAH solution
- Wafer cleaning with DI water